CATALOGUES
WHITE PAPERS
PRESS RELEASES
The ultimate solution for fully automated control on silicon wafer.
Features:
- Automatic wafer load / unload
- 6'' and 8'' wafers, 12'' on request
- Auto alignment
- Automatic measurement sequence :
. Bump dimensions
. Roughness (grinding, local stress)
. Step height
. Film thickness (photoresist, oxide,...)
- Custom report format :
. Chip per chip statistics
. Wafer per wafer statistics
. Temporal evolution of process parameters over several months
INTERNET USERS ALSO CONSULTED ON THE CATEGORY SOIL ANALYSIS
See also
Buyers
Find your suppliers Complete your request and let our teams find you the best deals available.Suppliers
Find your future clients List your products and services to enhance your web presence and receive qualified enquiries.