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CYBERSURF 3D: Automatic and manual semiconductor process control

Soil analysis

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The ultimate solution for fully automated control on silicon wafer.

Features:

- Automatic wafer load / unload
- 6'' and 8'' wafers, 12'' on request
- Auto alignment
- Automatic measurement sequence :
. Bump dimensions
. Roughness (grinding, local stress)
. Step height
. Film thickness (photoresist, oxide,...)
- Custom report format :
. Chip per chip statistics
. Wafer per wafer statistics
. Temporal evolution of process parameters over several months

OTHER PRODUCTS SOIL ANALYSIS FROM FOGALE NANOTECH

See also

Gas analysis Chemical analysis Air analysis Water analysis Combustion analyzers Composition of liquids and density Composition of solids Electrodes, Measuring probes

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