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MUXPONDER-5000-2

Network equipment

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DCI/OTN MuxPonder-5000-2 is an optoelectronic integrated WDM transmission platform 2U
Designed for Data Centre Interconnect (DCI), features high integration (optoelectronic integration), large bandwidth (25.6Tbits / Fiber), simple deployment (no complicated tuning), easy operation and maintenance (NETCONF / YANG) and safety and reliability.
 
It can meet the rapidly growing bandwidth demand between DCs, achieve flexible deployment of equipment, create an open optical network architecture and lead the DCI market into a new era of high-speed all-optical interconnection.

 
  • Adopt optoelectronic integrated, pluggable modular design; components support hot-plugging, deploy and expand on demand.
  • Front-air and rear-air cooling design, 2+1 FRU fan units available, automatic speed adjustment supported.
  • 19" / 600mm Depth cabinet can be installed, suitable for data center rooms and can be deployed with IT equipment in common cabinets.
  • Transmission capacity up to 25.6Tbit/s per pair @ C+ band 400G*64λ, up to 3.2Tbit/s per subrack.
  • Single wave capacity up to 400G, continuous evolution towards 600G & 800G & 1.2T.
  • Optical layer card highly integrated with OA, WSS, VOA, OSC, OTDR, OCM, OLP, etc. to simplify internal fiber connectivity.
  • Supports 10GE, 100GE, 100GE FlexE (Unware), 400GE, STM-64, 10GE WAN, OTU2, OTU4 and other service access.
  • Supports 9-degree ROADM networking and FlexGrid.
  • Supports comprehensive performance monitoring and quality visibility at the service, OTN and optical layers.
  • Provides multiple multi-layer network-level and device-level protection solutions. Protection reversal delay<50ms, ensuring superior protection performance.
  • Supports NETCONF/YANG standard open interface and GUI management platform based on B/S architecture.

 

Dimensions (H x W x D) 2U: 88 mm (H)×446 mm (W)×450 mm (D)
Download the complete technical features

Small network: single platform with high density optical layer card + electrical layer card for point-to-point networks. Medium / large network:stacking of multiple electrical layers + multi-degree ROADM to form a ring network.

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